Type | Clear Quartz Plate |
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Application | Semiconductor, optical |
Thickness | 0.5-100mm |
Shape | Step |
Processing Service | Bending, Welding, Punching, polishing |
Nama Produk | piring kaca kuarsa |
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Bahan | SIO2 |
Kekerasan | Morse 6.5 |
Suhu kerja | 1100 ℃ |
Kualitas permukaan | 20/40 atau 40/60 |